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Onsemi FUSB302TMPX

IC CONTROLLER USB TYPE C 14MLP
part number has RoHS
Manufacturer # :FUSB302TMPX
Manufacturer :Onsemi
Dasenic # :FUSB302TMPX-DS
Customer # :
Description : IC CONTROLLER USB TYPE C 14MLP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 0.7708$ 7.71
3000+$ 0.4282$ 1284.6
6000+$ 0.4097$ 2458.2
In Stock: 9508
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.7708
Total :$ 0.77
Delivery :
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  • Onsemi FUSB302TMPX technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Controllers Interface
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Package / Case:14-WFQFN Exposed Pad
  • Current - Supply:560mA
  • Interface:USB
  • Supplier Device Package:14-MLP (2.5x2.5)
  • Standards:USB 3.1
  • Voltage - Supply:2.7V ~ 5.5V
  • Protocol:USB
  • Function:Controller
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FUSB302TMPX provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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