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Onsemi FSUSB31L8X_F113

IC USB SWITCH DPST 8MICROPAK
part number has RoHS
Manufacturer # :FSUSB31L8X_F113
Manufacturer :Onsemi
Dasenic # :FSUSB31L8X_F113-DS
Customer # :
Description : IC USB SWITCH DPST 8MICROPAK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 62
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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FSUSB31L8X_F113 information

  • Onsemi FSUSB31L8X_F113 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Analog Switches - Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Features:Break-Before-Make, USB 2.0
  • Mounting Type:Surface Mount
  • Package / Case:8-UFQFN
  • Number of Channels:1
  • Supplier Device Package:8-MicroPak™
  • Multiplexer/ Demultiplexer Circuit:2:1
  • Switch Circuit:DPST
  • On- State Resistance ( Max):10Ohm
  • Voltage - Supply, Single ( V+):3V ~ 4.3V
  • Voltage - Supply, Dual ( V±):-
  • -3db Bandwidth:720MHz
  • Applications:USB
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FSUSB31L8X_F113 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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