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Onsemi FSBB30CH60DF

MODULE SPM 600V 30A SPMPA
part number has RoHS
Manufacturer # :FSBB30CH60DF
Manufacturer :Onsemi
Dasenic # :FSBB30CH60DF-DS
Customer # :
Description : MODULE SPM 600V 30A SPMPA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 22.6980$ 226.98
100+$ 19.4400$ 1944
1000+$ 19.0530$ 19053
10000+$ 18.2610$ 182610
In Stock: 7096
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 22.698
Total :$ 22.70
Delivery :
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FSBB30CH60DF information

  • Onsemi FSBB30CH60DF technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Not For New Designs
  • Mounting Type:Through Hole
  • Package / Case:27-PowerDIP Module (1.205", 30.60mm)
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Voltage:600 V
  • Current:30 A
  • Voltage - Isolation:2500Vrms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FSBB30CH60DF provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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