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Onsemi FSB50550BL

INTELLIGENT POWER MODULE, 500V,
part number has RoHS
Manufacturer # :FSB50550BL
Manufacturer :Onsemi
Dasenic # :FSB50550BL-DS
Customer # :
Description : INTELLIGENT POWER MODULE, 500V,
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 3.6198$ 7.24
In Stock: 3240
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.6198
Total :$ 3.62
Delivery :
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FSB50550BL information

  • Onsemi FSB50550BL technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Active
  • Mounting Type:Through Hole
  • Package / Case:23-PowerDIP Module (0.551", 14.00mm)
  • Type:MOSFET
  • Configuration:3 Phase Inverter
  • Voltage:500 V
  • Current:3 A
  • Voltage - Isolation:1500Vrms
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:Vendor omitted MSL Rating information
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FSB50550BL provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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