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Onsemi FND327C

DISPLAY 7SEG 0.36 SGL RED 10DIP
part number has RoHS
Manufacturer # :FND327C
Manufacturer :Onsemi
Dasenic # :FND327C-DS
Customer # :
Description : DISPLAY 7SEG 0.36 SGL RED 10DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
35+$ 3.1554$ 110.44
In Stock: 1816
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.1554
Total :$ 3.16
Delivery :
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FND327C information

  • Onsemi FND327C technical specifications, attributes, parameters.
  • Category:Optoelectronics Devices/Display Modules - LED Character and Numeric
  • Product Status:Obsolete
  • Color:Red
  • Package / Case:10-DIP (0.200", 5.08mm)
  • Size / Dimension:0.551" H x 0.299" W x 0.335" D (14.00mm x 7.60mm x 8.50mm)
  • Power Dissipation ( Max):100mW
  • Display Type:7-Segment
  • Current - Test:20mA
  • Voltage - Forward ( Vf) ( Typ):1.8V
  • Number of Characters:1
  • Display Format:-
  • Digit/ Alpha Size:0.36" (9.14mm)
  • Common Pin:Common Cathode
  • Millicandela Rating:3mcd
  • Wavelength - Peak:660nm
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FND327C provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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