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Onsemi FNB33060T6S
Manufacturer # :FNB33060T6S
Manufacturer :Onsemi
Dasenic # :FNB33060T6S-DS
Datasheet : FNB33060T6S Datasheet
Customer # :
Description : Stock, ship today
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In Stock: 1535
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.447
Total :$ 21.45
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FNB33060T6S information
Onsemi FNB33060T6S technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Power Driver Modules
- Product Status:Active
- Mounting Type:Through Hole
- Package / Case:27-PowerDIP Module (1.205", 30.60mm)
- Type:IGBT
- Configuration:3 Phase Inverter
- Voltage:600 V
- Current:30 A
- Voltage - Isolation:2500Vrms
- Series:Motion SPM® 3
- Base Product Number:FNB33060
- Packaging:Bulk
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FNB33060T6S provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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