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Onsemi FNA51560TD3

MODULE SPM 600V 15A 20PWRDIP
part number has RoHS
Manufacturer # :FNA51560TD3
Manufacturer :Onsemi
Dasenic # :FNA51560TD3-DS
Customer # :
Description : MODULE SPM 600V 15A 20PWRDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 8.9460$ 8.95
25+$ 8.7660$ 219.15
100+$ 8.4060$ 840.6
500+$ 8.0550$ 4027.5
1000+$ 7.6050$ 7605
In Stock: 13468
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.946
Total :$ 8.95
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FNA51560TD3 information

  • Onsemi FNA51560TD3 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Power Driver Modules
  • Product Status:Obsolete
  • Mounting Type:Through Hole
  • Package / Case:20-PowerDIP Module (1.220", 31.00mm)
  • Type:IGBT
  • Configuration:3 Phase Inverter
  • Voltage:600 V
  • Current:15 A
  • Voltage - Isolation:1500Vrms
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FNA51560TD3 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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