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Onsemi FNA40860B2
IGBT 600V 8A 26PWRDIP MOD
Manufacturer # :FNA40860B2
Manufacturer :Onsemi
Dasenic # :FNA40860B2-DS
Datasheet :
FNA40860B2 Datasheet
FNA40860B2 DatasheetCustomer # :
Description : IGBT 600V 8A 26PWRDIP MOD
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 11.1600 | $ 11.16 |
| 25+ | $ 10.9350 | $ 273.38 |
| 100+ | $ 10.4940 | $ 1049.4 |
| 500+ | $ 10.0440 | $ 5022 |
| 1000+ | $ 9.4860 | $ 9486 |
In Stock: 1716
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 11.16
Total :$ 11.16
Delivery :
Payment :
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FNA40860B2 information
Onsemi FNA40860B2 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Power Driver Modules
- Product Status:Obsolete
- Mounting Type:Through Hole
- Package / Case:26-PowerDIP Module (1.024", 26.00mm)
- Type:IGBT
- Configuration:3 Phase
- Voltage:600 V
- Current:8 A
- Voltage - Isolation:2000Vrms
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FNA40860B2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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