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Onsemi FMS6G15US60
Manufacturer # :FMS6G15US60
Manufacturer :Onsemi
Dasenic # :FMS6G15US60-DS
Datasheet : FMS6G15US60 Datasheet
Customer # :
Description : IGBT MODULE 600V 15A 73W 25PMAA
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In Stock: 73
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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FMS6G15US60 information
Onsemi FMS6G15US60 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 150°C (TJ)
- Mounting Type:Chassis Mount
- Package / Case:25PM-AA
- Power - Max:73 W
- Supplier Device Package:25PM-AA
- Configuration:Three Phase Inverter
- Input:Three Phase Bridge Rectifier
- Current - Collector ( Ic) ( Max):15 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- Current - Collector Cutoff ( Max):250 µA
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.7V @ 15V, 15A
- Input Capacitance ( Cies) @ Vce:935 pF @ 30 V
- N T C Thermistor:Yes
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FMS6G15US60 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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