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Onsemi FMBM5551-SB16001
Manufacturer # :FMBM5551-SB16001
Manufacturer :Onsemi
Dasenic # :FMBM5551-SB16001-DS
Datasheet : FMBM5551-SB16001 Datasheet
Customer # :
Description : TRANS NPN 160V 0.6A SSOT-6
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In Stock: 2120
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4036
Total :$ 0.40
Delivery :
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FMBM5551-SB16001 information
Onsemi FMBM5551-SB16001 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:SOT-23-6 Thin, TSOT-23-6
- Power - Max:700mW
- Supplier Device Package:SuperSOT™-6
- Transistor Type:2 NPN (Dual)
- Current - Collector ( Ic) ( Max):600mA
- Voltage - Collector Emitter Breakdown ( Max):160V
- Vce Saturation ( Max) @ Ib, Ic:200mV @ 5mA, 50mA
- Current - Collector Cutoff ( Max):50nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:80 @ 10mA, 5V
- Frequency - Transition:300MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FMBM5551-SB16001 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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