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Onsemi FIN1104MTCX
Manufacturer # :FIN1104MTCX
Manufacturer :Onsemi
Dasenic # :FIN1104MTCX-DS
Datasheet : FIN1104MTCX Datasheet
Customer # :
Description : IC REDRIVER LVDS 4CH 24TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 26411
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.258
Total :$ 3.26
Delivery :
Payment :
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FIN1104MTCX information
Onsemi FIN1104MTCX technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Signal Buffers, Repeaters, Splitters
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:24-TSSOP (0.173", 4.40mm Width)
- Current - Supply:41mA
- Type:Buffer, ReDriver
- Number of Channels:4
- Supplier Device Package:24-TSSOP
- Data Rate ( Max):800Mbps
- Output:LVDS
- Voltage - Supply:3V ~ 3.6V
- Input:LVDS, LVPECL
- Delay Time:1.75ns
- Signal Conditioning:-
- Capacitance - Input:2.6 pF
- Applications:LVDS
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FIN1104MTCX provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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