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Onsemi FIN1104MTC

Name: FIN1104MTC
Brand: Onsemi
SKU: FIN1104MTC-DS
Price: 1.9344 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 11164

MOQ: 1

5 Price Tiers

Mfr.Part # :FIN1104MTC
Manufacturer :Onsemi
Dasenic # :FIN1104MTC-DS
Datasheet : FIN1104MTC Datasheet PDF
Description : IC REDRIVER LVDS 4CH 24TSSOP
Package :-
Unit Price: $1.9344
Total: $1.93

Quantity	Unit Price	You Save
1-10	$1.9344	-
11-1525	$1.2896	33.3% save
1526-1600	$1.2556	35.1% save
1601-3100	$1.2393	35.9% save
3101-7700	$1.2234	36.8% save

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Onsemi FIN1104MTC technical specifications, attributes, parameters.

Category:Integrated Circuits (ICs)/Signal Buffers, Repeaters, Splitters

Product Status:Active

Operating Temperature:-40°C ~ 85°C

Mounting Type:Surface Mount

Package / Case:24-TSSOP (0.173", 4.40mm Width)

Current - Supply:41mA

Type:Buffer, ReDriver

Number of Channels:4

Supplier Device Package:24-TSSOP

Data Rate ( Max):800Mbps

Output:LVDS

Voltage - Supply:3V ~ 3.6V

Input:LVDS, LVPECL

Delay Time:1.75ns

Signal Conditioning:-

Capacitance - Input:2.6 pF

Applications:LVDS

EU RoHS Status:RoHS Compliant

REACH Status:REACH is not affected

US ECCN:EAR99

China RoHS Status:Green Symbol: Green and environmentally friendly product

FIN1104MTC provided by Onsemi

Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.

Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.

With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.