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Onsemi FGB30N6S2
Manufacturer # :FGB30N6S2
Manufacturer :Onsemi
Dasenic # :FGB30N6S2-DS
Datasheet : FGB30N6S2 Datasheet
Customer # :
Description : IGBT 600V 45A 167W TO263AB
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In Stock: 1725
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.909
Total :$ 0.91
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FGB30N6S2 information
Onsemi FGB30N6S2 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
- Input Type:Standard
- Power - Max:167 W
- Supplier Device Package:D2PAK (TO-263)
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):45 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.5V @ 15V, 12A
- Current - Collector Pulsed ( Icm):108 A
- Switching Energy:55µJ (on), 100µJ (off)
- Gate Charge:23 nC
- Td (on/off) @ 25° C:6ns/40ns
- Test Condition:390V, 12A, 10Ohm, 15V
- EU RoHS Status:ROHS3 Compliant
- US ECCN:EAR99
- HTS US:8541.29.0095
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FGB30N6S2 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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