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Onsemi FEP16BT
Manufacturer # :FEP16BT
Manufacturer :Onsemi
Dasenic # :FEP16BT-DS
Datasheet : FEP16BT Datasheet
Customer # :
Description : DIODE ARRAY GP 100V 16A TO220AB
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In Stock: 2927
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.912
Total :$ 1.91
Delivery :
Payment :
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FEP16BT information
Onsemi FEP16BT technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Obsolete
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Supplier Device Package:TO-220-3
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard
- Voltage - Forward ( Vf) ( Max) @ If:950 mV @ 8 A
- Current - Reverse Leakage @ Vr:10 µA @ 100 V
- Diode Configuration:1 Pair Common Cathode
- Voltage - D C Reverse ( Vr) ( Max):100 V
- Current - Average Rectified ( Io) (per Diode):16A
- Reverse Recovery Time (trr):35 ns
- Operating Temperature - Junction:-55°C ~ 150°C
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FEP16BT provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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