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Onsemi FDMC6675BZ-T

INTEGRATED CIRCUIT
part number has RoHS
Manufacturer # :FDMC6675BZ-T
Manufacturer :Onsemi
Dasenic # :FDMC6675BZ-T-DS
Customer # :
Description : INTEGRATED CIRCUIT
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
In Stock: 25
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
Delivery :
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FDMC6675BZ-T information

  • Onsemi FDMC6675BZ-T technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Single
  • Product Status:Obsolete
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Technology:-
  • Supplier Device Package:-
  • Power Dissipation ( Max):-
  • F E T Type:-
  • F E T Feature:-
  • Drain to Source Voltage ( Vdss):-
  • Current - Continuous Drain ( Id) @ 25° C:9.5A (Ta), 20A (Tc)
  • Rds On ( Max) @ Id, Vgs:-
  • Vgs(th) ( Max) @ Id:-
  • Gate Charge ( Qg) ( Max) @ Vgs:-
  • Input Capacitance ( Ciss) ( Max) @ Vds:-
  • Drive Voltage ( Max Rds On, Min Rds On):-
  • Vgs ( Max):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FDMC6675BZ-T provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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