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Onsemi FAN3850AUC16X

IC AMP CLASS AB MONO 6WLCSP
part number has RoHS
Manufacturer # :FAN3850AUC16X
Manufacturer :Onsemi
Dasenic # :FAN3850AUC16X-DS
Customer # :
Description : IC AMP CLASS AB MONO 6WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.0600$ 2.06
In Stock: 1030
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.06
Total :$ 2.06
Delivery :
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FAN3850AUC16X information

  • Onsemi FAN3850AUC16X technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Linear - Amplifiers - Audio
  • Product Status:Last Time Buy
  • Operating Temperature:-30°C ~ 85°C (TA)
  • Features:ADC, Microphone
  • Mounting Type:Surface Mount
  • Package / Case:6-XFBGA, WLCSP
  • Type:Class AB
  • Output Type:1-Channel (Mono)
  • Supplier Device Package:6-WLCSP (1.26x0.86)
  • Voltage - Supply:1.64V ~ 3.63V
  • Max Output Power x Channels @ Load:-
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.33.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FAN3850AUC16X provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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