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Onsemi EFC6612R-A-TF
Manufacturer # :EFC6612R-A-TF
Manufacturer :Onsemi
Dasenic # :EFC6612R-A-TF-DS
Datasheet : EFC6612R-A-TF Datasheet
Customer # :
Description : MOSFET 2N-CH 20V 23A EFCP
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In Stock: 6459
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.4388
Total :$ 0.44
Delivery :
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EFC6612R-A-TF information
Onsemi EFC6612R-A-TF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
- Product Status:Obsolete
- Operating Temperature:-
- Mounting Type:Surface Mount
- Package / Case:6-SMD, No Lead
- Power - Max:2.5W
- Supplier Device Package:6-CSP (1.77x3.54)
- F E T Type:2 N-Channel (Dual) Asymmetrical
- F E T Feature:Logic Level Gate, 2.5V Drive
- Drain to Source Voltage ( Vdss):-
- Current - Continuous Drain ( Id) @ 25° C:-
- Rds On ( Max) @ Id, Vgs:-
- Vgs(th) ( Max) @ Id:-
- Gate Charge ( Qg) ( Max) @ Vgs:27nC @ 4.5V
- Input Capacitance ( Ciss) ( Max) @ Vds:-
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EFC6612R-A-TF provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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