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Onsemi ECH8601M-TL-H-P
Manufacturer # :ECH8601M-TL-H-P
Manufacturer :Onsemi
Dasenic # :ECH8601M-TL-H-P-DS
Datasheet : ECH8601M-TL-H-P Datasheet
Customer # :
Description : MOSFET 2N-CH
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In Stock: 22
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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ECH8601M-TL-H-P information
Onsemi ECH8601M-TL-H-P technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - FETs, MOSFETs - Arrays
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:8-SMD, Flat Lead
- Power - Max:-
- Supplier Device Package:8-ECH
- F E T Type:2 N-Channel (Dual) Common Drain
- F E T Feature:Logic Level Gate, 2.5V Drive
- Drain to Source Voltage ( Vdss):24V
- Current - Continuous Drain ( Id) @ 25° C:8A (Ta)
- Rds On ( Max) @ Id, Vgs:23mOhm @ 4A, 4.5V
- Vgs(th) ( Max) @ Id:1.3V @ 1mA
- Gate Charge ( Qg) ( Max) @ Vgs:7.5nC @ 4.5V
- Input Capacitance ( Ciss) ( Max) @ Vds:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
ECH8601M-TL-H-P provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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