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Onsemi CAV25640VE-GT3
Manufacturer # :CAV25640VE-GT3
Manufacturer :Onsemi
Dasenic # :CAV25640VE-GT3-DS
Datasheet : CAV25640VE-GT3 Datasheet
Customer # :
Description : IC EEPROM 64KBIT SPI 10MHZ 8SOIC
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In Stock: 11764
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3137
Total :$ 0.31
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CAV25640VE-GT3 information
Onsemi CAV25640VE-GT3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-SOIC (0.154", 3.90mm Width)
- Technology:EEPROM
- Supplier Device Package:8-SOIC
- Memory Size:64Kb (8K x 8)
- Memory Type:Non-Volatile
- Voltage - Supply:2.5V ~ 5.5V
- Clock Frequency:10 MHz
- Access Time:-
- Memory Format:EEPROM
- Memory Interface:SPI
- Write Cycle Time - Word, Page:5ms
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.32.0051
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CAV25640VE-GT3 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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