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Onsemi CAT5113YI-01-T3
Manufacturer # :CAT5113YI-01-T3
Manufacturer :Onsemi
Dasenic # :CAT5113YI-01-T3-DS
Datasheet : CAT5113YI-01-T3 Datasheet
Customer # :
Description : IC DGTL POT 1KOHM 100TAP 8TSSOP
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In Stock: 52
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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CAT5113YI-01-T3 information
Onsemi CAT5113YI-01-T3 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Data Acquisition - Digital Potentiometers
- Product Status:Obsolete
- Tolerance:±20%
- Operating Temperature:-40°C ~ 85°C
- Features:-
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Interface:Up/Down (U/D, INC, CS)
- Supplier Device Package:8-TSSOP
- Configuration:Potentiometer
- Number of Circuits:1
- Memory Type:Non-Volatile
- Voltage - Supply:2.5V ~ 6V
- Taper:Linear
- Number of Taps:100
- Resistance ( Ohms):1K
- Temperature Coefficient ( Typ):300ppm/°C
- Resistance - Wiper ( Ohms) ( Typ):1000 (Max)
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:OBSOLETE
- HTS US:0000.00.0000
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
CAT5113YI-01-T3 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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