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Onsemi CAT25256VI-GT3

IC EEPROM 256KBIT SPI 8SOIC
part number has RoHS
Manufacturer # :CAT25256VI-GT3
Manufacturer :Onsemi
Dasenic # :CAT25256VI-GT3-DS
Customer # :
Description : IC EEPROM 256KBIT SPI 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.3578$ 0.36
In Stock: 24954
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3578
Total :$ 0.36
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CAT25256VI-GT3 information

  • Onsemi CAT25256VI-GT3 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Technology:EEPROM
  • Supplier Device Package:8-SOIC
  • Memory Size:256Kb (32K x 8)
  • Memory Type:Non-Volatile
  • Voltage - Supply:1.8V ~ 5.5V
  • Clock Frequency:20 MHz
  • Access Time:-
  • Memory Format:EEPROM
  • Memory Interface:SPI
  • Write Cycle Time - Word, Page:5ms
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CAT25256VI-GT3 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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