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Onsemi BYV32-200
Manufacturer # :BYV32-200
Manufacturer :Onsemi
Dasenic # :BYV32-200-DS
Datasheet : BYV32-200 Datasheet
Customer # :
Description : DIODE ARRAY GP 200V 8A TO220AB
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In Stock: 2242
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.5464
Total :$ 2.55
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Onsemi BYV32-200 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Arrays
- Product Status:Obsolete
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Supplier Device Package:TO-220
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard
- Voltage - Forward ( Vf) ( Max) @ If:1.15 V @ 20 A
- Current - Reverse Leakage @ Vr:50 µA @ 200 V
- Diode Configuration:1 Pair Common Cathode
- Voltage - D C Reverse ( Vr) ( Max):200 V
- Current - Average Rectified ( Io) (per Diode):8A
- Reverse Recovery Time (trr):35 ns
- Operating Temperature - Junction:-65°C ~ 175°C
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.10.0080
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BYV32-200 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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