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Onsemi BCV27
Manufacturer # :BCV27
Manufacturer :Onsemi
Dasenic # :BCV27-DS
Datasheet : BCV27 Datasheet
Customer # :
Description : TRANS NPN DARL 30V 1.2A SOT23-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 49193
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.145
Total :$ 0.14
Delivery :
Payment :
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BCV27 information
Onsemi BCV27 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:350 mW
- Supplier Device Package:SOT-23-3
- Transistor Type:NPN - Darlington
- Current - Collector ( Ic) ( Max):1.2 A
- Voltage - Collector Emitter Breakdown ( Max):30 V
- Vce Saturation ( Max) @ Ib, Ic:1V @ 100µA, 100mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:20000 @ 100mA, 5V
- Frequency - Transition:220MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BCV27 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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