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Onsemi BCP56T1G
Manufacturer # :BCP56T1G
Manufacturer :Onsemi
Dasenic # :BCP56T1G-DS
Datasheet : BCP56T1G Datasheet
Customer # :
Description : TRANS NPN 80V 1A SOT223
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In Stock: 16728
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0721
Total :$ 0.07
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BCP56T1G information
Onsemi BCP56T1G technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:-65°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-261-4, TO-261AA
- Power - Max:1.5 W
- Supplier Device Package:SOT-223 (TO-261)
- Transistor Type:NPN
- Current - Collector ( Ic) ( Max):1 A
- Voltage - Collector Emitter Breakdown ( Max):80 V
- Vce Saturation ( Max) @ Ib, Ic:500mV @ 50mA, 500mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:40 @ 150mA, 2V
- Frequency - Transition:130MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0075
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BCP56T1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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