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Onsemi BC556ABU
TRANS PNP 65V 0.1A TO92-3
Manufacturer # :BC556ABU
Manufacturer :Onsemi
Dasenic # :BC556ABU-DS
Datasheet :
BC556ABU Datasheet
BC556ABU DatasheetCustomer # :
Description : TRANS PNP 65V 0.1A TO92-3
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| Quantity | Unit Price | Total |
In Stock: 43352
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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BC556ABU information
Onsemi BC556ABU technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-226-3, TO-92-3 (TO-226AA)
- Power - Max:500 mW
- Supplier Device Package:TO-92-3
- Transistor Type:PNP
- Current - Collector ( Ic) ( Max):100 mA
- Voltage - Collector Emitter Breakdown ( Max):65 V
- Vce Saturation ( Max) @ Ib, Ic:650mV @ 5mA, 100mA
- Current - Collector Cutoff ( Max):15nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:110 @ 2mA, 5V
- Frequency - Transition:150MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0075
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BC556ABU provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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