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Onsemi B300W35A102XYG

IC AUDIO SIGNAL PROCESSR 35WLCSP
part number has RoHS
Manufacturer # :B300W35A102XYG
Manufacturer :Onsemi
Dasenic # :B300W35A102XYG-DS
Customer # :
Description : IC AUDIO SIGNAL PROCESSR 35WLCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 14.9940$ 14.99
25+$ 14.6970$ 367.43
100+$ 14.0940$ 1409.4
500+$ 13.4910$ 6745.5
1000+$ 12.7440$ 12744
In Stock: 7981
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 14.994
Total :$ 14.99
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B300W35A102XYG information

  • Onsemi B300W35A102XYG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Audio Special Purpose
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:35-VFBGA, WLCSP
  • Number of Channels:4
  • Interface:GPIO, I²C, PCM, SPI, UART
  • Specifications:12.8kHz
  • Supplier Device Package:35-WLCSP (3.63x2.68)
  • Voltage - Supply:0.9V ~ 2V
  • Applications:Digital Audio Interfacing
  • Function:Audio Signal Processor
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:3A991A2
  • HTS US:8542.31.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
B300W35A102XYG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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