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Onsemi AX5243-1-TW30
Manufacturer # :AX5243-1-TW30
Manufacturer :Onsemi
Dasenic # :AX5243-1-TW30-DS
Datasheet : AX5243-1-TW30 Datasheet
Customer # :
Description : IC RF TXRX ISM<1GHZ 20VFQFN
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In Stock: 7304
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.0028
Total :$ 7.00
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Payment :
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AX5243-1-TW30 information
Onsemi AX5243-1-TW30 technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver ICs
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:20-VFQFN Exposed Pad
- Frequency:27MHz ~ 1.05GHz
- Type:TxRx Only
- Sensitivity:-137dBm
- Supplier Device Package:20-QFN (4x4)
- Data Rate ( Max):125kbps
- Memory Size:-
- Voltage - Supply:1.8V ~ 3.6V
- Power - Output:16dBm (Max)
- Protocol:-
- Serial Interfaces:SPI
- R F Family/ Standard:General ISM < 1GHz
- Current - Receiving:6.5mA ~ 11mA
- Modulation:4FSK, ASK, FSK, GFSK, GMSK, MSK, PSK
- G P I O:-
- Current - Transmitting:48mA
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AX5243-1-TW30 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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