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Onsemi 7WBD383BMX1TCG
Manufacturer # :7WBD383BMX1TCG
Manufacturer :Onsemi
Dasenic # :7WBD383BMX1TCG-DS
Datasheet : 7WBD383BMX1TCG Datasheet
Customer # :
Description : IC BUS FET EXCHG SW 2X1:1 8ULLGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.156
Total :$ 0.16
Delivery :
Payment :
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7WBD383BMX1TCG information
Onsemi 7WBD383BMX1TCG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Mounting Type:Surface Mount
- Package / Case:8-XFLGA
- Type:Bus FET Exchange Switch
- Supplier Device Package:8-ULLGA (1.6x1)
- Voltage - Supply:4V ~ 5.5V
- Voltage Supply Source:Single Supply
- Current - Output High, Low:-
- Circuit:2 x 1:1
- Independent Circuits:1
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
7WBD383BMX1TCG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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