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Onsemi 7SB3125DTT1G

IC BUS SWITCH 1 X 1:1 5TSOP
part number has RoHS
Manufacturer # :7SB3125DTT1G
Manufacturer :Onsemi
Dasenic # :7SB3125DTT1G-DS
Customer # :
Description : IC BUS SWITCH 1 X 1:1 5TSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0216$ 0.02
In Stock: 17476
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0216
Total :$ 0.02
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7SB3125DTT1G information

  • Onsemi 7SB3125DTT1G technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:SOT-23-5 Thin, TSOT-23-5
  • Type:Bus Switch
  • Supplier Device Package:5-TSOP
  • Voltage - Supply:4V ~ 5.5V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:-
  • Circuit:1 x 1:1
  • Independent Circuits:1
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
7SB3125DTT1G provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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