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Onsemi 74VHC273M
Manufacturer # :74VHC273M
Manufacturer :Onsemi
Dasenic # :74VHC273M-DS
Datasheet : 74VHC273M Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 8BIT 20SOIC
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In Stock: 42869
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.3898
Total :$ 0.39
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74VHC273M information
Onsemi 74VHC273M technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Type:D-Type
- Output Type:Non-Inverted
- Supplier Device Package:20-SOIC
- Number of Elements:1
- Voltage - Supply:2V ~ 5.5V
- Clock Frequency:110 MHz
- Number of Bits per Element:8
- Current - Output High, Low:8mA, 8mA
- Max Propagation Delay @ V, Max C L:11ns @ 5V, 50pF
- Current - Quiescent ( Iq):4 µA
- Trigger Type:Positive Edge
- Input Capacitance:4 pF
- Function:Master Reset
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74VHC273M provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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