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Onsemi 74LVTH162244MTD

IC BUF NON-INVERT 3.6V 48TSSOP
part number has RoHS
Manufacturer # :74LVTH162244MTD
Manufacturer :Onsemi
Dasenic # :74LVTH162244MTD-DS
Customer # :
Description : IC BUF NON-INVERT 3.6V 48TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
33+$ 0.1616$ 5.33
100+$ 0.1608$ 16.08
250+$ 0.1604$ 40.1
In Stock: 7322
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1616
Total :$ 0.16
Delivery :
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74LVTH162244MTD information

  • Onsemi 74LVTH162244MTD technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Buffers, Drivers, Receivers, Transceivers
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFSOP (0.240", 6.10mm Width)
  • Input Type:-
  • Output Type:3-State
  • Supplier Device Package:48-TSSOP
  • Number of Elements:4
  • Voltage - Supply:2.7V ~ 3.6V
  • Logic Type:Buffer, Non-Inverting
  • Number of Bits per Element:4
  • Current - Output High, Low:12mA, 12mA
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74LVTH162244MTD provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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