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Onsemi 74F113PC
Manufacturer # :74F113PC
Manufacturer :Onsemi
Dasenic # :74F113PC-DS
Datasheet : 74F113PC Datasheet
Customer # :
Description : IC FF JK TYPE DUAL 1BIT 14DIP
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In Stock: 1580
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.944
Total :$ 0.94
Delivery :
Payment :
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74F113PC information
Onsemi 74F113PC technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Obsolete
- Operating Temperature:0°C ~ 70°C (TA)
- Mounting Type:Through Hole
- Package / Case:14-DIP (0.300", 7.62mm)
- Type:JK Type
- Output Type:Complementary
- Supplier Device Package:14-MDIP
- Number of Elements:2
- Voltage - Supply:4.5V ~ 5.5V
- Clock Frequency:105 MHz
- Number of Bits per Element:1
- Current - Output High, Low:1mA, 20mA
- Max Propagation Delay @ V, Max C L:6ns @ 5V, 50pF
- Current - Quiescent ( Iq):19 mA
- Trigger Type:Negative Edge
- Input Capacitance:-
- Function:Set(Preset) and Reset
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74F113PC provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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