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Onsemi 74ALVC162601T

TXRX 18BIT UNIV BUS LV 56TSSOP
part number has RoHS
Manufacturer # :74ALVC162601T
Manufacturer :Onsemi
Dasenic # :74ALVC162601T-DS
Customer # :
Description : TXRX 18BIT UNIV BUS LV 56TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
34+$ 3.5759$ 121.58
In Stock: 1366
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.5759
Total :$ 3.58
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74ALVC162601T information

  • Onsemi 74ALVC162601T technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Universal Bus Functions
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:56-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package:56-TSSOP
  • Number of Circuits:18-Bit
  • Voltage - Supply:1.65V ~ 3.6V
  • Logic Type:Universal Bus Transceiver
  • Current - Output High, Low:24mA, 24mA; 12mA, 12mA
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • EU RoHS Status:RoHS Compliant
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
74ALVC162601T provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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