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NXP Semiconductors NX3L2267GU,115
IC SWITCH SPDTX2 750MOHM 10XQFN
Manufacturer # :NX3L2267GU,115
Manufacturer :NXP Semiconductors
Dasenic # :NX3L2267GU,115-DS
Datasheet :
NX3L2267GU,115 Datasheet
NX3L2267GU,115 DatasheetCustomer # :
Description : IC SWITCH SPDTX2 750MOHM 10XQFN
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 5+ | $ 0.1989 | $ 0.99 |
In Stock: 5958
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.1989
Total :$ 0.20
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Payment :
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NX3L2267GU,115 information
NXP Semiconductors NX3L2267GU,115 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Interface - Analog Switches, Multiplexers, Demultiplexers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:10-XFQFN
- Supplier Device Package:10-XQFN (1.4x1.8)
- Number of Circuits:2
- Multiplexer/ Demultiplexer Circuit:2:1
- Switch Circuit:SPDT
- On- State Resistance ( Max):750mOhm
- Voltage - Supply, Single ( V+):1.4V ~ 4.3V
- -3db Bandwidth:60MHz
- Switch Time ( Ton, Toff) ( Max):40ns, 20ns
- Charge Injection:37pC
- Channel Capacitance ( C S(off), C D(off)):35pF
- Current - Leakage ( I S(off)) ( Max):10nA
- Crosstalk:-90dB @ 100kHz
- Base Product Number:NX3L2267
- Channel-to- Channel Matching (& Delta; Ron):90mOhm
- Packaging:Dasenic-Reel®
- Packaging:Cut Tape (CT)
- Packaging:Tape & Reel (TR)
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NX3L2267GU,115 provided by NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) is one of the top ten non-storage semiconductor companies in the world and the world's largest automotive semiconductor supplier.
NXP offers a wide range of semiconductor products and solutions, including microcontrollers, microprocessors, power management, analog and mixed-signal ICs, RF devices, security and encryption solutions, and more.
As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets while delivering solutions that advance a more sustainable future.
NXP Semiconductors was founded in 1953 as a spin-off from Philips Electronics and has its headquarters in Eindhoven, Netherlands. It was previously known as Philips Semiconductors before becoming an independent company.
Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 team members and branches in more than 30 countries.
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