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MoSys™ MSR630AGC-2512
Manufacturer # :MSR630AGC-2512
Manufacturer :MoSys™
Dasenic # :MSR630AGC-2512-DS
Datasheet : MSR630AGC-2512 Datasheet
Customer # :
Description : IC MEMORY BW BURST 1GB FCBGA
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In Stock: 75
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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MSR630AGC-2512 information
MoSys™ MSR630AGC-2512 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Memory Integrated Circuit
- Product Status:Obsolete
- Mounting Type:Surface Mount
- Package / Case:2512-BGA, FCBGA
- Technology:SRAM, RLDRAM
- Supplier Device Package:2512-FCBGA (27x27)
- Memory Size:1Gbit
- Memory Type:Volatile
- Access Time:2.7 ns
- Memory Format:RAM
- Memory Interface:Parallel
- Memory Organization:16M x 72
- Packaging:Tray
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MSR630AGC-2512 provided by MoSys™
MoSys, Inc. (NASDAQ:MOSY) is focused on Accelerating Data Intelligence and provides both semiconductor and IP solutions that enable fast, intelligent data access and decision making for a wide range of markets including cloud networking, security, 5G networks, SmartNIC, test and measurement, and video systems. MoSys's Quazar family of high-speed memories and the Blazar family of Accelerator Engines are memory integrated circuits with unmatched intelligence, performance and capacity that eliminate data access bottlenecks to deliver speed and intelligence in systems, including those scaling from 100G to multi-terabits per second. MoSys's Stellar family of Virtual Accelerator Engines includes its Packet Classification Platforms for LPM and ACL-based applications embedded in Achronix, Intel and Xilinx FPGAs. This IP accelerates applications and is portable across a wide range of hardware configurations with or without MoSys silicon chips.
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