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Micron Technology MT61K512M32KPA-24:U

GDDR6 16G 512MX32 FBGA DDP
part number has RoHS
Manufacturer # :MT61K512M32KPA-24:U
Manufacturer :Micron Technology
Dasenic # :52CC33-DS
Customer # :
Description : GDDR6 16G 512MX32 FBGA DDP Box Box Box
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 86.056500$ 860.57
1260+$ 57.371000$ 72287.46
In Stock: 709
MOQ :1 PCS
Packaging :Box Box Box
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 86.0565
Total :$ 86.06
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MT61K512M32KPA-24:U information

Product Details
The MT61K512M32KPA-24 is a 16Gb (2GB) DDR3 SDRAM memory chip, designed to operate at frequencies up to 1600 MT/s. It is organized as 512M x 32 bits (16Gb), which makes it suitable for high-performance applications requiring substantial memory bandwidth. Functions - Data Storage: Provides temporary storage for data being processed by the CPU or GPU. - Memory Management: Supports various memory management functions, including row activation and precharging, which are crucial for efficient memory operations. - Data Transfer: Ensures high-speed data transfer between the memory and the host system. Applications - Consumer Electronics: Used in smartphones, tablets, and laptops for fast memory access. - Embedded Systems: Integrated into various embedded systems including automotive systems, IoT devices, and industrial equipment. - Networking Equipment: Plays a role in routers and switches where high-speed data processing is necessary. - Graphics Cards: Employed in graphics cards to facilitate game and multimedia applications. Alternative Parts - MT61K512M32KPA-18: A similar DDR3 chip with a different speed grade. - MT41K256M16HA-125: A lower-density option that may offer alternative configurations for specific design requirements. - Hynix H5TQ2G83EFR: Another competitor in the DDR3 market that provides similar functionalities. Embedded Modules - DDR3 SDRAM Modules: These may come in various configurations, such as SO-DIMM or UDIMM, depending on the system requirements. - System on Chip (SoC) Solutions: Some advanced MCU and FPGA solutions utilize embedded memory configurations combining several memory types, including configurations using Micron’s DRAM products. Related Q&A Q1: What is the data rate of the Micron MT61K512M32KPA-24? A1: The data rate of the MT61K512M32KPA-24 is up to 1600 MT/s (mega-transfers per second). Q2: How is the MT61K512M32KPA-24 typically used in consumer electronics? A2: In consumer electronics, the MT61K512M32KPA-24 is used as system memory (RAM) in devices such as smartphones, tablets, and laptops, where it supports fast data access and processing. Q3: Can the MT61K512M32KPA-24 be used in automotive applications? A3: Yes, the MT61K512M32KPA-24 can be used in automotive applications, particularly in infotainment systems or advanced driver-assistance systems (ADAS), where high-speed memory is required. Q4: What are some alternatives to the Micron MT61K512M32KPA-24? A4: Alternatives to the MT61K512M32KPA-24 include the MT61K512M32KPA-18 and Hynix H5TQ2G83EFR, which offer similar DDR3 functionalities. Q5: How does the MT61K512M32KPA-24 handle memory management? A5: The MT61K512M32KPA-24 handles memory management through on-chip mechanisms that manage row activation, precharging, and burst transfers to optimize data throughput and reduce latency during read and write operations.
  • Micron Technology MT61K512M32KPA-24:U technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory
  • Product Status:Active
  • Operating Temperature:0°C ~ 95°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:180-TFBGA
  • Technology:SGRAM - GDDR6
  • Supplier Device Package:180-FBGA (12x14)
  • Memory Size:16Gbit
  • Memory Type:Volatile
  • Voltage - Supply:1.3095V ~ 1.3905V
  • Clock Frequency:12 GHz
  • Memory Format:DRAM
  • Memory Interface:POD_135
  • Memory Organization:512M x 32
  • Packaging:Box
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