Name: 2031-6334-00
Brand: MACOM®
SKU: DS-8555703
Price: 7164.26 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $7164.2600

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MACOM® 2031-6334-00

HYBRID,OCTAVE-BAND,180_DEG,

Manufacturer # :2031-6334-00

Manufacturer :MACOM®

Dasenic # :2031-6334-00-DS

Datasheet :

2031-6334-00 Datasheet

Customer # :

Customer #

Description : HYBRID,OCTAVE-BAND,180_DEG,

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Quantity	Unit Price	Total
1+	$ 7164.2600	$ 7164.26

In Stock: 2674

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 7164.26

Total :$ 7164.26

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2031-6334-00 information

MACOM® 2031-6334-00 technical specifications, attributes, parameters.
Category:RF and Wireless/RF Directional Coupler
Product Status:Active
Package / Case:Module, SMA Connectors
Frequency:4GHz ~ 8GHz
Power - Max:30W
Supplier Device Package:-
Insertion Loss:0.7dB
Isolation:20dB
Return Loss:-
Coupler Type:Standard
Coupling Factor:-
Applications:General Purpose
MSL Rating:1 (Unlimited, 30°C/85%RH)
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product

Download datasheets and manufacturer documentation for MACOM® 2031-6334-00
Datasheet:
2031-6334-00,

MACOM® 2031-6334-00 Environmental and export classification status description
The Macom® 2031-6334-00 is a component within the RF and Wireless category that is designed for specific applications within the wireless communication industry. This component is used in various devices to enable wireless connectivity and communication. Functions: - The Macom® 2031-6334-00 serves as a critical component in RF and wireless systems, helping to facilitate signal transmission and reception. - It aids in amplifying signals, filtering unwanted frequencies, and enhancing overall performance in wireless communication devices. Applications: - Common applications of the Macom® 2031-6334-00 include wireless routers, base stations, IoT devices, and other wireless communication equipment. - It is utilized in various industries where wireless connectivity is essential, such as telecommunications, Internet of Things (IoT), and smart devices. Alternative Components: - Alternative components to the Macom® 2031-6334-00 may include integrated RF modules from other manufacturers or specific RF components tailored to different specifications. - Some alternatives may offer different performance characteristics, footprint sizes, or price points depending on the specific application requirements. Embedded Modules: - Embedded modules compatible with the Macom® 2031-6334-00 may include RF transceivers, amplifiers, filters, or modulators/demodulators for complete wireless system integration. - These embedded modules further enhance the functionality and performance of the overall wireless communication system. Related Q&A: 1. What is the typical operating frequency range of the Macom® 2031-6334-00 component? 2. Can this component be used in 5G wireless communication systems? 3. What are the key parameters to consider when integrating the Macom® 2031-6334-00 into a wireless device design? 4. Are there specific design guidelines or reference schematics available for incorporating this component into a PCB layout? 5. How does the Macom® 2031-6334-00 compare to similar RF components in terms of performance and cost-efficiency?

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Delivering Time
For in-stock parts, orders are estimated to ship out in 1-3 days. Dasenic ships orders once a day at about 6pm except Sunday. Once shipped, estimated delivery time depends on the below carriers you chose.
DHL	DHL Express, 3-7 business days DHL eCommerce，12-22 business days
FedEx	3-7 business days
UPS	5-7 business days

2031-6334-00 provided by Macom®

Founded in 1950, MACOM Technology Solutions (NASDAQ:MTSI) designs and manufactures high-performance semiconductor products for the Telecommunications, Industrial and Defense and Datacenter industries. MACOM services over 6,000 customers annually with a broad product portfolio that incorporates RF, Microwave, Analog and Mixed Signal and Optical semiconductor technologies. Headquartered in Lowell, MA, USA, MACOM has more than 70 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operates facilities throughout the United States, Europe, and Asia. In addition, MACOM offers foundry and design services that represents a key core competency within our business.