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Texas Instruments IS25LP256H-RMLE-TY

IC FLASH 256MBIT SPI/QUAD 16SOIC
part number has RoHS
Manufacturer # :IS25LP256H-RMLE-TY
Manufacturer :Texas Instruments
Dasenic # :IS25LP256H-RMLE-TY-DS
Customer # :
Description : IC FLASH 256MBIT SPI/QUAD 16SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 7.8713$ 78.71
352+$ 6.5594$ 2308.91
In Stock: 2493
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 7.8713
Total :$ 7.87
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IS25LP256H-RMLE-TY information

  • Texas Instruments IS25LP256H-RMLE-TY technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Technology:FLASH - NOR
  • Supplier Device Package:16-SOIC
  • Memory Size:256Mbit
  • Memory Type:Non-Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Clock Frequency:166 MHz
  • Memory Format:Flash
  • Memory Interface:SPI - Quad I/O, QPI, DTR
  • Write Cycle Time - Word, Page:50µs, 1ms
  • Memory Organization:32M x 8
  • Packaging:Tray
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
IS25LP256H-RMLE-TY provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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