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Logical Systems Inc. PA-TS1D6SM18-56
Manufacturer # :PA-TS1D6SM18-56
Manufacturer :Logical Systems Inc.
Dasenic # :PA-TS1D6SM18-56-DS
Datasheet : PA-TS1D6SM18-56 Datasheet
Customer # :
Description : ADAPTER 56TSOP TO 56DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1522
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 56
Total :$ 56.00
Delivery :
Payment :
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PA-TS1D6SM18-56 information
Logical Systems Inc. PA-TS1D6SM18-56 technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Sockets for ICs, Transistors - Adapters
- Product Status:Active
- Mounting Type:Through Hole
- Termination:Solder
- Convert From ( Adapter End):TSOP
- Convert To ( Adapter End):DIP
- Housing Material:-
- Pitch - Mating:0.020" (0.50mm)
- Contact Finish - Mating:-
- Contact Finish - Post:-
- Number of Pins:56
- Pitch - Post:0.100" (2.54mm)
- Board Material:-
PA-TS1D6SM18-56 provided by Logical Systems Inc.
Logical Systems Inc.(LSI) has been in continuous operation since 1985 with core competencies in process & piping, mechanical, electrical, information, and automation & controls systems.
LSI is involved in various types of projects using an array of technologies. These projects almost always utilize systems such as Distributed Control Systems (DCS), Programmable Logic Controllers (PLC), sensing devices, motion control, and variable frequency drives.
As a natural extension of our electrical and controls expertise, we expand our capabilities to provide project management, process and mechanical engineering, construction management, and, in select cases, full-service EPC for a number of our clients. These added capabilities are now a major component of our service offerings.
LSI is a growing multi-service engineering company, employing over 200 skilled individuals worldwide, with offices in Memphis and Jackson, Rossville, Golden, Murray, Phoenix, Toronto, Ontario, Guangzhou, and Taipei.
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