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Laird Technologies EMI 78136071
Manufacturer # :78136071
Manufacturer :Laird Technologies EMI
Dasenic # :78136071-DS
Datasheet : 78136071 Datasheet
Customer # :
Description : RF COND FOAM SHEET 24.016X24.016
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1566
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 85.941
Total :$ 85.94
Delivery :
Payment :
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78136071 information
Laird Technologies EMI 78136071 technical specifications, attributes, parameters.
- Category:RF and Wireless/RFI and EMI - Shielding and Absorbing Materials
- Product Status:Active
- Material:Polyurethane Foam
- Operating Temperature:90°C
- Type:Absorbing Sheet
- Shape:Square
- Width:24.000" (609.60mm)
- Length:24.000" (609.60mm)
- Adhesive:-
- Thickness - Overall:0.126" (3.20mm)
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
78136071 provided by Laird Technologies EMI
Laird is a global technology business focused on enabling wireless communication and smart systems, and providing components and systems that protect electronics. Laird operates through two divisions, Wireless Systems and Performance Materials. Wireless Systems solutions include antenna systems, embedded wireless modules, telematics products and wireless automation and control solutions. Performance Materials solutions include electromagnetic interference shielding, thermal management and signal integrity products.Custom products are supplied to major sectors of the electronics industry including the handset, telecommunications, IT, automotive, public safety, consumer, medical, rail, mining and industrial markets. Providing value and differentiation to our customers through innovation, reliable fulfilment and speed, Laird PLC is listed and headquartered in London, and employs over 9,000 people in more than 58 facilities located in 18 countries.
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