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ISSI® IS66WVE4M16EBLL-70BLI

TFBGA-48(6x8) SRAM
part number has RoHS
Manufacturer # :IS66WVE4M16EBLL-70BLI
Manufacturer :ISSI®
Dasenic # :51D8B4-DS
Customer # :
Description : TFBGA-48(6x8) SRAM TFBGA-48(6x8)
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.331000$ 2.33
10+$ 2.331000$ 23.31
25+$ 2.331000$ 58.28
50+$ 2.331000$ 116.55
100+$ 2.331000$ 233.1
In Stock: 8947
MOQ :1 PCS
Packaging :TFBGA-48(6x8)
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.331
Total :$ 2.33
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IS66WVE4M16EBLL-70BLI information

Product Details
The ISSI® IS66WVE4M16EBLL-70BLI is a high-performance synchronous dynamic random-access memory (SDRAM) device that is designed for use in various electronic systems requiring memory storage. It features a compact, low-power, and high-speed solution suitable for both mobile and embedded applications. Functions - Memory Storage: Utilizes DRAM technology to store data temporarily for quick access by the processor. - Synchronous Interface: Offers a synchronous interface that synchronizes memory operations with the clock cycles of the system. - High-Speed Access: Provides fast read and write access for efficient data processing, with a certain operating speed (e.g., 70 ns). - Low Power Consumption: Designed to operate at lower voltages and power levels which are crucial for battery-operated devices. Applications - Mobile Devices: Smartphones, tablets, and handheld devices where space and power efficiency are critical. - Embedded Systems: Various embedded computing applications including automotive systems, medical devices, and consumer electronics. - Networking: Routers, switches, and other networking equipment that require reliable memory solutions. - Industrial Computing: Applications in machinery control and automation that benefit from high-speed memory. Alternative Parts There are several alternative parts that could fulfill similar requirements: - Micron MT48LC16M16A2P-75: Another SDRAM part with comparable specifications. - Samsung K4S641632H: Suitable for similar applications with varying speed and density options. - Hynix HY5DU121622F: Offers similar capacity and performance levels for use in embedded systems. - It’s always a good practice to check compatibility and ensure the specifications meet the requirements for your specific application. Embedded Modules The IS66WVE4M16EBLL-70BLI can be integrated into various embedded modules such as: - System on Modules (SoMs): Combining processor, memory, and other peripherals into one compact module. - Development Boards: Such as those used in prototyping for IoT devices, where efficient memory access is essential. - Custom PCB designs: In specialized applications where the memory is a key component of the design. Related Q&A Q1: What is the main advantage of using the ISSI® IS66WVE4M16EBLL-70BLI SDRAM in mobile devices? A1: The main advantage is its low power consumption combined with high-speed operations, which makes it ideal for battery-operated devices requiring efficient memory solutions. Q2: Can the IS66WVE4M16EBLL-70BLI be used in automotive applications? A2: Yes, it can be used in automotive applications that require reliable and fast memory for embedded systems, making it suitable for infotainment systems, control units, etc. Q3: What specifications should be checked when considering alternative parts to the IS66WVE4M16EBLL-70BLI? A3: Key specifications to verify include operating speed, voltage levels, memory density, interface compatibility, and package type to ensure seamless integration into existing systems. Q4: How does the synchronous interface of the IS66WVE4M16EBLL-70BLI enhance its performance? A4: The synchronous interface allows memory operations to be synchronized with the system clock, resulting in faster data access and improved overall system performance. Q5: What types of embedded modules can utilize the IS66WVE4M16EBLL-70BLI? A5: It can be utilized in various embedded modules, including System on Modules (SoMs), development boards for rapid prototyping, and custom PCB designs for specialized applications.
  • ISSI® IS66WVE4M16EBLL-70BLI technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:48-TFBGA
  • Technology:PSRAM (Pseudo SRAM)
  • Supplier Device Package:48-TFBGA (6x8)
  • Memory Size:64Mbit
  • Memory Type:Volatile
  • Voltage - Supply:2.7V ~ 3.6V
  • Access Time:70 ns
  • Memory Format:PSRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:70ns
  • Base Product Number:IS66WVE4M16
  • Memory Organization:4M x 16
  • Packaging:Tray
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