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Intel Corporation 10AS016E3F29I2SG

IC SOC CORTEX-A9 1.5GHZ 780FBGA
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Manufacturer # :10AS016E3F29I2SG
Manufacturer :Intel Corporation
Dasenic # :0294C1-DS
Customer # :
Description : IC SOC CORTEX-A9 1.5GHZ 780FBGA 780-BBGA, FCBGA Tray
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QuantityUnit PriceTotal
1+$ 2048.640000$ 2048.64
In Stock: 1502
MOQ :1 PCS
Packaging :780-BBGA, FCBGA Tray
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 2048.64
Total :$ 2048.64
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10AS016E3F29I2SG information

Product Details
The Intel 10AS016E3F29I2SG is a Field Programmable Gate Array (FPGA) device based on Intel's Arria 10 architecture. It offers high performance, flexibility, and low power consumption, making it suitable for a range of applications in areas such as telecommunications, automotive, data centers, and industrial automation. Functions 1. Programmability: The device can be programmed to perform complex computations and data processing tasks. 2. Parallel Processing: It supports parallel processing, enabling high-speed data handling and execution. 3. Digital Signal Processing (DSP): It features dedicated DSP blocks for efficient signal processing. 4. Flexibility: Users can tailor its architecture to meet specific application requirements. 5. Interface Support: It supports various high-speed interfaces, including PCIe, Ethernet, and more. Applications 1. Telecommunication: Used in signal processing and network functions. 2. Data Centers: Implements acceleration in data processing tasks. 3. Automotive: Functions in applications such as Advanced Driver Assistance Systems (ADAS). 4. Industrial Automation: Serves in machine vision and robotics. 5. Embedded Systems: Utilized for real-time processing in embedded applications. Alternative Parts 1. Xilinx Kintex UltraScale FPGAs: Comparable in terms of performance and configurability. 2. Lattice Semiconductor ECP5 FPGAs: Targeted for lower power requirements. 3. Microsemi SmartFusion FPGAs: Integrated ARM Cortex-M3 processor for mixed-signal applications. 4. Intel Cyclone V FPGAs: Lower-cost alternative with less performance. 5. Xilinx Zynq SoC: Combines an FPGA with a processor for versatile applications. Embedded Modules Embedded modules incorporating the Intel 10AS016E3F29I2SG may include: 1. Development Kits: Intel FPGA development kits that include platform support for various applications. 2. System on Module (SoM): Integrated modules that combine FPGAs, processors, and I/O interfaces for ease of design. 3. Network Interface Cards (NICs): Utilizing FPGA for enhanced network processing capabilities in data center solutions. Related Q&A 1. Q: What are the main applications of the Intel 10AS016E3F29I2SG FPGA? A: The main applications include telecommunications, data center acceleration, automotive systems, industrial automation, and various embedded systems. 2. Q: What are the key benefits of using the Intel 10AS016E3F29I2SG in design projects? A: Key benefits include high performance, low power consumption, programmability for specific tasks, and support for complex signal processing through dedicated hardware resources. 3. Q: How does the Intel 10AS016E3F29I2SG compare to its alternatives? A: Compared to alternatives like Xilinx Kintex and Lattice ECP5, the Intel 10AS016E3F29I2SG offers superior performance but might have different power and cost characteristics, depending on specific application needs. 4. Q: What kind of development kits are available for the Intel 10AS016E3F29I2SG? A: Intel offers various development kits that provide support for the 10AS016E3F29I2SG, enabling designers to prototype and develop applications efficiently. 5. Q: Can the Intel 10AS016E3F29I2SG be used for real-time processing? A: Yes, the 10AS016E3F29I2SG is designed to handle real-time processing applications, making it suitable for areas such as embedded systems and industrial automation.
  • Intel Corporation 10AS016E3F29I2SG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/System On Chip(SoC)
  • Product Status:Active
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:780-BBGA, FCBGA
  • Supplier Device Package:780-FBGA, FC (29x29)
  • Peripherals:DMA, POR, WDT
  • Architecture:MCU, FPGA
  • Number of I/ O:288
  • Speed:1.5GHz
  • Core Processor:Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • R A M Size:256KB
  • Connectivity:EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Primary Attributes:FPGA - 160K Logic Elements
  • Series:Arria 10 SX
  • Packaging:Tray
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