Name: BGA 619 E6327
Brand: Infineon Technologies
SKU: DS-8495330
Price: 0.2151 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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Infineon Technologies BGA 619 E6327

IC RF AMP CDMA 1.9GHZ TSLP7-1

Manufacturer # :BGA 619 E6327

Manufacturer :Infineon Technologies

Dasenic # :BGA 619 E6327-DS

Datasheet :

BGA 619 E6327 Datasheet

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Description : IC RF AMP CDMA 1.9GHZ TSLP7-1

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Quantity	Unit Price	Total
10+	$ 0.2151	$ 2.15
100+	$ 0.1665	$ 16.65
1000+	$ 0.1206	$ 120.6
10000+	$ 0.1206	$ 1206

In Stock: 8412

MOQ :1 PCS

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Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

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Unit Price :$ 0.2151

Total :$ 0.22

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BGA 619 E6327 information

Infineon Technologies BGA 619 E6327 technical specifications, attributes, parameters.
Category:RF and Wireless/RF Amplifiers
Product Status:Obsolete
Mounting Type:Surface Mount
Package / Case:6-XFDFN Exposed Pad
Frequency:1.9GHz
Current - Supply:11mA
Supplier Device Package:PG-TSLP-7-1
Voltage - Supply:2.78V
Gain:14dB
Noise Figure:1.5dB
P1d B:-
R F Type:CDMA, CDMA2000, PCS
Test Frequency:1.96GHz
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Infineon Technologies BGA 619 E6327
Datasheet:
BGA 619 E6327,

Infineon Technologies BGA 619 E6327 Environmental and export classification status description
The Infineon Technologies BGA 619 E6327 is a compact Ball Grid Array (BGA) component designed for RF and wireless applications. It provides high performance in a small package, making it suitable for various wireless communication devices. Functions: The BGA 619 E6327 component functions as a critical part of wireless systems by facilitating signal processing, amplification, and filtering for ensuring smooth data transmission. Applications: The Infineon Technologies BGA 619 E6327 can be used in a wide range of applications, including: 1. Cellular network infrastructure 2. Wireless communication systems 3. Internet of Things (IoT) devices 4. Satellite communication systems 5. Radar systems Alternative Components: For RF and wireless applications similar to the Infineon Technologies BGA 619 E6327, alternative components from other manufacturers may include: 1. Skyworks Solutions RF components 2. Qorvo RF amplifiers 3. Broadcom wireless ICs 4. Analog Devices RF integrated circuits Embedded Modules: There might be embedded modules with similar functionalities that incorporate the Infineon Technologies BGA 619 E6327 component as part of a larger system-on-chip or module. These modules may provide more integrated functions for specific applications. Related Q&A: 1. Q: What are the key specifications of the Infineon Technologies BGA 619 E6327? A: The Infineon BGA 619 E6327 features high gain, low noise figure, and wide bandwidth, making it ideal for RF and wireless applications. 2. Q: How does the BGA 619 E6327 contribute to improving the efficiency of wireless communication systems? A: The BGA 619 E6327 helps in amplifying signals, reducing noise, and improving the overall performance of wireless systems. 3. Q: Can the Infineon Technologies BGA 619 E6327 be used in 5G networks? A: Yes, the BGA 619 E6327 can be integrated into 5G network infrastructure to enhance data transmission and reception capabilities. 4. Q: Are there any specific design considerations when using the BGA 619 E6327 in IoT devices? A: Designers should consider power consumption, integration with other IoT components, and compatibility with wireless protocols when deploying the BGA 619 E6327 in IoT devices. 5. Q: How does the BGA 619 E6327 support the development of next-generation wireless technologies? A: The BGA 619 E6327 provides the necessary RF performance and compact form factor required for advancing wireless technologies like 5G, IoT, and smart devices.

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BGA 619 E6327 provided by Infineon Technologies

Infineon Technologies AG (OTCMKTS: IFNNY) is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company's semiconductor products include ASIC, Battery Management ICs, Clocks & Timing Solutions, ESD and Surge Protection, Memories Microcontroller, RF, Security & smart card solutions, Sensor, Small Signal Transistors & Diodes, Transceivers, Wireless Connectivity, Software, and more. These products are used in automotive, green industrial power, power management, sensing solutions, and security in IoT applications. Infineon Technologies was founded in 1999 as a spin-off from Siemens AG. The company is headquartered in Neubiberg, near Munich, Germany, and boasts approximately 56,200 employees and 155 locations worldwide.