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IDT, Integrated Device Technology Inc ZSSC3123AA1D

DICE (WAFER SAWN) - WAFFLE PACK
part number has RoHS
Manufacturer # :ZSSC3123AA1D
Dasenic # :ZSSC3123AA1D-DS
Customer # :
Description : DICE (WAFER SAWN) - WAFFLE PACK
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
100+$ 10.8588$ 1085.88
In Stock: 904
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.8588
Total :$ 10.86
Delivery :
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Payment :
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ZSSC3123AA1D information

  • IDT, Integrated Device Technology Inc ZSSC3123AA1D technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Interface - Sensor and Detector Interfaces
  • Product Status:Active
  • Series:*
  • Base Product Number:ZSSC3123
  • Packaging:Tray
  • HTS US:0000.00.0000
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ZSSC3123AA1D provided by IDT, Integrated Device Technology Inc
Renesas Electronics Corporation (TSE: 6723) is the world's premier supplier of microcontrollers and a preferred provider of advanced semiconductor solutions. Renesas Electronics was established in November 2002 through the merger of two major Japanese semiconductor companies: Hitachi Semiconductor and Mitsubishi Electric. As a global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of applications, including automotive, industrial, home electronics, office automation, and information communication technology. The company's global headquarters are located in Tokyo.Renesas Electronics has a significant global footprint, with offices, research and development centers, manufacturing facilities, and sales operations in Europe, the Middle East, Asia, and North America.
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