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Harwin Inc. D0818-01
Manufacturer # :D0818-01
Manufacturer :Harwin Inc.
Dasenic # :D0818-01-DS
Datasheet : D0818-01 Datasheet
Customer # :
Description : CONN IC DIP SOCKET 18POS GOLD
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In Stock: 1258
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.0339
Total :$ 4.03
Delivery :
Payment :
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D0818-01 information
Harwin Inc. D0818-01 technical specifications, attributes, parameters.
- Category:Connectors & Interconnects/Sockets for ICs, Transistors
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C
- Features:Open Frame
- Mounting Type:Through Hole
- Termination:Wire Wrap
- Type:DIP, 0.3" (7.62mm) Row Spacing
- Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled
- Pitch - Mating:0.100" (2.54mm)
- Contact Finish - Mating:Gold
- Contact Finish Thickness - Mating:10.0µin (0.25µm)
- Contact Finish - Post:Tin
- Number of Positions or Pins ( Grid):18 (2 x 9)
- Pitch - Post:0.100" (2.54mm)
- Contact Material - Mating:Beryllium Copper
- Contact Finish Thickness - Post:196.9µin (5.00µm)
- Contact Material - Post:Brass
D0818-01 provided by Harwin Inc.
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