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GeneSiC Semiconductor FR20DR02
Manufacturer # :FR20DR02
Manufacturer :GeneSiC Semiconductor
Dasenic # :FR20DR02-DS
Datasheet : FR20DR02 Datasheet
Customer # :
Description : DIODE GEN PURP REV 200V 20A DO5
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In Stock: 2008
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 20.12
Total :$ 20.12
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FR20DR02 information
GeneSiC Semiconductor FR20DR02 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Diodes - Rectifiers - Single
- Product Status:Active
- Mounting Type:Chassis, Stud Mount
- Package / Case:DO-203AB, DO-5, Stud
- Supplier Device Package:DO-5
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Diode Type:Standard, Reverse Polarity
- Current - Average Rectified ( Io):20A
- Voltage - Forward ( Vf) ( Max) @ If:1 V @ 20 A
- Current - Reverse Leakage @ Vr:25 µA @ 50 V
- Capacitance @ Vr, F:-
- Voltage - D C Reverse ( Vr) ( Max):200 V
- Reverse Recovery Time (trr):200 ns
- Operating Temperature - Junction:-40°C ~ 125°C
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FR20DR02 provided by GeneSiC Semiconductor
GeneSiC Semiconductor is a pioneer and world-leader in silicon carbide (SiC) technology. Leading global manufacturers depend on GeneSiC’s technology to elevate the performance and efficiency of their products. GeneSiC’s electronic components run cooler, faster, and more economically and play a key role in conserving energy in a wide array of high-power systems. GeneSiC holds leading patents on wide band-gap power device technologies, a market that is projected to reach more than $5 billion by 2025. Our core strengths of design, process and technology add more value to our customers’ end-product, with performance and cost metrics setting new standards in the silicon carbide industry.
In August 2022,Navitas Semiconductor (Nasdaq: NVTS)announced the acquisition of GeneSiC Semiconductor.
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