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Future Designs Inc. SOMDIMM-RX63N
Manufacturer # :SOMDIMM-RX63N
Manufacturer :Future Designs Inc.
Dasenic # :SOMDIMM-RX63N-DS
Datasheet : SOMDIMM-RX63N Datasheet
Customer # :
Description : IC MOD RX600/RX63N 100MHZ 128KB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 2918
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 210
Total :$ 210.00
Delivery :
Payment :
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SOMDIMM-RX63N information
Future Designs Inc. SOMDIMM-RX63N technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - Microcontroller, Microprocessor, FPGA Modules
- Product Status:Active
- Operating Temperature:-
- Size / Dimension:-
- Connector Type:SO-DIMM-200
- Speed:100MHz
- Module/ Board Type:MCU Core
- Core Processor:RX600, RX63N
- Co- Processor:-
- Flash Size:2MB
- R A M Size:128KB
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8537.10.9130
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SOMDIMM-RX63N provided by Future Designs Inc.
Founded in 1989 and located in Huntsville, AL,Future Designs, Inc. (FDI)is a full service design and production company that specializes in transforming “back-of-a-napkin” concepts into tangible product plans. FDI offers its customers hardware, software, mechanical, and system-level expertise and a 26-year history of proven success to provide any level of support from prototyping through high volume production. Our ELI®, uEZ® GUI and ΣyG™ product families for touch screen LCD graphical user interface and human machine interface applications are “off-the-shelf” solutions for quick and cost effective upgrades to user interfaces. FDI is committed to minimizing your time-to-market, reducing costs and eliminating your product-development headaches.
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.