Name: MPC755BPX300LE
Brand: Flip Electronics
SKU: DS-5672836
Price: 265.62 USD
Availability: InStock
Rating: 4.8 (3 reviews)

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1 : $265.6200

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Flip Electronics MPC755BPX300LE

IC MPU MPC7XX 300MHZ 360FCBGA

Manufacturer # :MPC755BPX300LE

Manufacturer :Flip Electronics

Dasenic # :MPC755BPX300LE-DS

Datasheet :

MPC755BPX300LE Datasheet

Customer # :

Customer #

Description : IC MPU MPC7XX 300MHZ 360FCBGA

Pricing (USD) : *To apply for a price, please click the Send Target Price button

Quantity	Unit Price	Total
5+	$ 265.6200	$ 1328.1

In Stock: 986

MOQ :1 PCS

Packaging :-

Delivery Time :Ship Within 48 Hours

Shipping Origin :Shenzhen or Hong Kong Warehouse

Quantity :

Unit Price :$ 265.62

Total :$ 265.62

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MPC755BPX300LE information

Flip Electronics MPC755BPX300LE technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/Embedded - Microprocessors
Product Status:Obsolete
Operating Temperature:0°C ~ 105°C (TA)
Package / Case:360-BBGA, FCBGA
Supplier Device Package:360-FCPBGA (25x25)
Voltage - I/ O:2.5V, 3.3V
Speed:300MHz
Core Processor:PowerPC
Number of Cores/ Bus Width:1 Core, 32-Bit
Co- Processors/ D S P:-
R A M Controllers:-
Graphics Acceleration:No
Display & Interface Controllers:-
Ethernet:-
S A T A:-
U S B:-
Security Features:-
EU RoHS Status:RoHS non-compliant
MSL Rating:3 (168 Hours,30°C/60%RH)
REACH Status:REACH Unaffected
US ECCN:3A991A2
HTS US:8542.31.0001
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period

Download datasheets and manufacturer documentation for Flip Electronics MPC755BPX300LE
Datasheet:
MPC755BPX300LE,

Flip Electronics MPC755BPX300LE Environmental and export classification status description
The NXP Semiconductors MPC755BPX300LE is a high-performance integrated circuit (IC) under the Integrated Circuits (ICs) category. It is designed to deliver powerful computing capabilities in a compact form factor. Functions: 1. High-Performance Computing: The MPC755BPX300LE is capable of processing complex instructions efficiently. 2. System Control: It provides control functions for managing various aspects of a system. 3. Integrated Memory Controller: The IC includes an integrated memory controller for improved memory management. Applications: 1. Embedded Systems: The MPC755BPX300LE can be used in embedded systems for industrial automation, automotive applications, and more. 2. Networking Equipment: It is suitable for use in networking equipment such as routers and switches. 3. Telecommunications: The IC can also be used in telecommunications infrastructure for data processing and control. Alternative Components: 1. Microchip ATmega328P: A lower-end alternative for simpler applications. 2. Texas Instruments TMS320C6748: A higher-end alternative with more processing power. 3. STMicroelectronics STM32F407: An alternative with a focus on power efficiency. Embedded Modules: 1. Wi-Fi Module: An embedded Wi-Fi module can be added to enable wireless connectivity. 2. Bluetooth Module: A Bluetooth module can be integrated for wireless communication. 3. Ethernet Module: An Ethernet module can provide wired networking capabilities. Related Q&A: 1. Can the MPC755BPX300LE be used in automotive applications requiring real-time data processing? 2. What are the advantages of using the MPC755BPX300LE in industrial automation compared to other ICs? 3. How does the integrated memory controller in the MPC755BPX300LE improve system performance? 4. Are there any development boards available for prototyping with the MPC755BPX300LE? 5. Can the MPC755BPX300LE handle multitasking applications in embedded systems effectively?

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Delivering Time
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