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Flexxon Pte Ltd FDMM064GBE-3201
Manufacturer # :FDMM064GBE-3201
Manufacturer :Flexxon Pte Ltd
Dasenic # :FDMM064GBE-3201-DS
Datasheet : FDMM064GBE-3201 Datasheet
Customer # :
Description : FXADV II MICROSD 64GB 3D TLC DIA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1510
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 109.3
Total :$ 109.30
Delivery :
Payment :
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FDMM064GBE-3201 information
Flexxon Pte Ltd FDMM064GBE-3201 technical specifications, attributes, parameters.
- Category:Memory Cards & Modules/Memory Cards
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Technology:TLC
- Memory Size:64GB
- Memory Type:microSD™
- Series:FxAdv II
- Packaging:Tray
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- HTS US:8523.51.0000
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FDMM064GBE-3201 provided by Flexxon Pte Ltd
Flexxon Pte Ltd., the world's leader in designs, manufactures, and markets Industrial NAND Flash Storge Solution products with 100% focus on niche markets. We apply our profound knowledge to serve and support tailored specifically for Cybersecurity, Industrial, Medical and Automotive (CIMA) applications and customers globally who desire the highest level of reliability, endurance and wide operating temperature ranges.
At FLEXXON, our mission is to be your preferred & reliable partner for Flash Storage and Memory Solution provider. We guarantee the highest standard of quality and product reliability.
Founded in 2007 and Headquartered in Singapore and with offices in the US, Malaysia, Taiwan and Hong Kong, Flexxon continues to expand on its novel hardware-based cybersecurity solutions portfolio.
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