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Fanstel Corp. LN60G840F
LN60G840F
Manufacturer # :LN60G840F
Manufacturer :Fanstel Corp.
Dasenic # :LN60G840F-DS
Datasheet :
LN60G840F Datasheet
LN60G840F DatasheetCustomer # :
Description : LN60G840F
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 174.3800 | $ 174.38 |
| 10+ | $ 138.0400 | $ 1380.4 |
| 20+ | $ 128.5400 | $ 2570.8 |
| 50+ | $ 118.7400 | $ 5937 |
In Stock: 1509
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 174.38
Total :$ 174.38
Delivery :
Payment :
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LN60G840F information
Fanstel Corp. LN60G840F technical specifications, attributes, parameters.
- Category:RF and Wireless/RF Transceiver Modules and Modems
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Card Edge
- Package / Case:Module
- Frequency:-
- Sensitivity:-108dBm
- Utilized I C / Part:BT840F, nRF9160
- Memory Size:1MB Flash, 256kB RAM
- Voltage - Supply:2.5V ~ 5.5V
- Power - Output:23dBm
- Protocol:Bluetooth v5.1, Bluetooth v5.2, LTE-M/NB-IoT, Thread, Zigbee®
- Data Rate:125kbps
- Serial Interfaces:GPIO, UART, USB
- R F Family/ Standard:802.15.4, Bluetooth, Cellular
- Antenna Type:Integrated, Trace + U.FL
- Current - Receiving:-
- Modulation:-
- Current - Transmitting:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:5A002A1
- HTS US:8517.62.0090
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
LN60G840F provided by Fanstel Corp.
Fanstel Corp. was established in 1990 as a Caller ID products manufacturers. Our main business was making caller ID products for phone companies. A partial list of our customers: Verizon, AT&T (SBC), Sprint, British Telecom, Telmex (Mexico). Our products evolve from the original Caller ID boxes to VoIP solutions for enterprise, Android desktop phone, and specialized phones for the hearing impaired.
We have the following capabilities in-house:
Hardware engineering;
Firmware engineering;
iOS and Android OS app development;
PCB layout, multiple layers, controlled impedance, 0.1mm buried vias;
SMT line to handle 01005 passive components, BGA with 0.3mm pitch.
As a vertically integrated manufacturer, we can continue using testing and field results to improve our production processes. Rework rate of our second generation modules (e.g., BT832) is in PPM (Part Per Million).
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We can prompt fulfill customer requests for electronic components, even for scarce parts in the market.